Upholding the principles of integrity, stability, and sustainable growth, Greatek fosters a people-oriented management culture, emphasizes innovation and R&D excellence, and is dedicated to providing high-quality, efficient, and customer-satisfying services. Through long-term partnerships built on trust, the company aims to achieve mutual success with its customers.

Greatek has demonstrated outstanding achievements in capital accumulation and revenue growth, securing a leading position in the IC packaging and testing industry through the collective efforts of its employees.

Greatek offers a wide range of packaging solutions, including:
Plastic Dual In-line Package (P-DIP), Small Outline Packages (SOP, SOJ, SSOP, TSSOP, MSOP), Plastic Quad Flat Package (QFP, LQFP, TQFP), Plastic Leaded Chip Carrier (PLCC), Diode Packages (TO), Quad Flat No-lead Package (QFN), Ball Grid Array (BGA, LGA), Flip Chip Packages (Flip Chip QFN, SOP, SOT), 8-inch Wafer Level CSP (WLCSP), Wafer Bumping, Cu Pillar Bump Flip Chip, and Redistribution Layer (RDL) technology.

Testing services include Wafer Testing (Circuit Probing) and Final Testing.
To meet the growing demand from wireless communication, networking, consumer electronics, and portable device markets, Greatek continues to advance in Stacked Die Packages, Multi-Chip Modules (MCM), and Copper Wire Bonding technologies for mass production.