SOIC / SSOP / TSSOP
Overview
Small-outline Package (SOP or SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent DIP, with a typical thickness that is 70% less.
Greatek specializes in SOP assembly and offers not only in narrow body, but also expanded to wide body SOIC, mini-SOP, Shrink Small-outline Package (SSOP), and Thin Shrink Small-outline Package (TSSOP). We have a full complete assembly line up with large assembly & test capacity in SOIC group.
Our expertise can also be expanded to related pin counts sharing SOIC tooling/equipment.
Feature
- Au wire diameter from 0.8mil to 2.0mil.
- Cu wire diameter available from 0.8mil to 1.2mil.
- Pin Counts: from 7L up to 64L.
- Min. PKG thickness: 0.8mm.
- Green PKG & ROHS REACH compliance.
- Pure matte tin plating.
- Multi-die and stack die assembly available.
Packing method
Tube / Tape & Reel available.
Reliability Qualification
| Moisture Sensitivity Level | JEDEC MSL3 (30°C / 60% RH / 192hrs) |
| Temp. Cycle Test | -65/+150°C, 500 cycles |
| Pressure Cooker Test | 121°C, 100% RH, 2 atm, 168hrs |
| High Temp. Storage Test | 150°C, 500hrs |