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| 1- |
Assembly Service in Greatek |
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Assembly Service Overview |
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Package Family |
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Assembly Process Capability |
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New Technology Package |
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| 2- |
Assembly Service Overview |
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Greatek Electronic Inc. provides completed the cost-effective and high-performed assembly service and time-to-market for IC packaging. Greatek offers a full suite of assembly solutions to meet customer's IC packaging needs, from standard plastic, advanced stacked die, and multi-chip assembly. |
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| 3- |
Package Families |
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Plastic Dual-inline Package Family |
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P-DIP, Skinny P-DIP, Shrink P-DIP. |
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Small Outline Package Family |
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SOP, SSOP, TSSOP, TSOP, MSOP, SOJ |
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Quad Flat Package Family> |
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QFP, LQFP, TQFP, PLCC |
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TO, SOT |
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Quad Flat Package Family |
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Customer Package |
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LGA, Pre-mold Package, Transparent Package. |
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| 4- |
Assembly Process Capability |
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Wafer Back Grinding |
12” / 8” / 6” wafer |
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Wafer Dicing |
12” / 8” / 6” wafer |
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Die Attach |
Paste / DAF / WBC / Hi-thermal |
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Flip Chip Bond |
Cu Pillar |
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Wire Bond |
Au / Cu / Ag / 0.7 mil ~ 2.0 mil |
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Encapsulation |
Package Thickness 0.50mm up / transparent m/c |
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Marking |
Laser and Printing |
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Trimming & Forming |
Lead Pitch 0.40mm up |
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Singulation |
Package Size 1.0x1.0 up |
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Tape Reel |
Package Size 1.0x1.0 up |
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| 5- |
New Technology Package |
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Copper wire bonding. |
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Ag alloy wire bonding. |
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FOW wire bonding. |
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Thin Package Encapsulation |
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Stacked Die (Two Die) |
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MCM (Three Die) |
