超豐電子Greatek Electronics Inc.

Product Overview
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Wafer Bumping
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Wafer Level CSP
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BGA/LGA
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Flip Chip CSP
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QFN/DFN
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Flip Chip QFN/DFN/SOP/TSOT
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P-DIP
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TO＆SOT
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SOIC / SSOP / TSSOP
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SOJ＆PLCC
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QFP / LQFP / TQFP

Flip Chip QFN/DFN/SOP/TSOT

Overview

FC-QFN (Flip-Chip Quad Flat No lead) is a molded package using flip chip interconnections on a copper lead frame. This package provides small form factor compared with conventional QFP packages. And it also provides better electrical performance due to the short electrical path.
Greatek offers a complete flip chip line of QFN/DFN/SOP/TSOT products, QFN/DFN package sizes from 1x1 to 6X6mm, developed to fulfill customers' requests.



Feature
Same package with up to 2X larger die.
Improvement in self-inductance and capacitance.
lower thermal resistance.
Reduction in resistance vs wire bond.
QFN/DFN MSL1 is capable.
Green PKG & ROHS REACH compliance
Pure matte tin plating are available
Only support copper pillar bump (C2)
QFN/DFN PKG thickness: 0.35,0.45, 0.55, 0.75, 0.85 mm.
Full in-house package and bumping layout design capability.
Full in-house assembly and test capability.
Full in-house electrical, thermal and mechanical simulation and measurement capability.
Wide range of open tool leadframe and die pad sizes available
Packing method
JEDEC Tray / Tape & Reel available.

Reliability Qualification
Moisture Sensitivity Level	JEDEC MSL3 (30°C / 60% RH / 192hrs)
Temp. Cycle Test	-65/+150°C, 500 cycles
Pressure Cooker Test	121°C, 100% RH, 2 atm, 168hrs
High Temp. Storage Test	150°C, 500hrs

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