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Overview
Ball-grid arrays (BGA) are IC packages, which place output pins in the form of a solder ball matrix. The traces of the BGA are generally fabricated on laminated substrates (BT-based) or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. As the number of leads surrounding the ICs increased, high lead count packages experienced significant electrical shorting problems. BGA technology solves this problem by effectively creating leads on the bottom surface of the package in the form of small bumps or solder balls. BGA packages can be used for high performance applications with high I/O connections and high thermal and electrical requirements.
Package Configurations |
 Body Sizes(mm)
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3x3 to 12x12 with square or rectangular body size options; Common body sizes: 5x5, 6x6, 7x17, 8x8, 9x9, 10x10, 12x12, |
Ball Count |
26 to 289 |
Ball Pitch (mm) |
0.4 to 0.65 |
Typ. Pkg. Thickness |
LFBGA: 1.40mm max.
TFBGA: 1.20mm max.
VFBGA: 1.00mm max
WFBGA: 0.80mm max |
Feature |
Flexible body sizes range from 3 x 3mm to 12 x 12mm with
square or rectangular body size options.
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0.40, 0.50, 0.65mm ball pitch. |
Mold cap 0.45/0.54/0.7mm are available. |
Au (0.7/0.8/0.9/1.0 mil)and Cu (0.7/0.8/0.9/1.0 mil)wire are
available
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Multi-die and stack die assembly are available. |
Green package available. |
Substrate layer 2/4 layer available. |
JEDEC standard compliant. |
Full in-house package and substrate design capability. |
Full in-house assembly and test capability. |
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Packing method |
JEDEC Tray / Tape & Reel available |
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Reliability Qualification |
Moisture Sensitivity Level |
JEDEC MSL3 (30°C / 60% RH / 192hrs) |
Temp. Cycle Test |
-65/+150°C, 500 cycles |
Pressure Cooker Test |
121°C, 100% RH, 2 atm, 168hrs |
High Temp. Storage Test |
150°C, 500hrs |
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