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Overview
Small-outline Package (SOP or SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent DIP, with a typical thickness that is 70% less.
Greatek specializes in SOP assembly and offers not only in narrow body, but also expanded to wide body SOIC, mini-SOP, Shrink Small-outline Package (SSOP), and Thin Shrink Small-outline Package (TSSOP).
We have a full complete assembly line up with large assembly & test capacity in SOIC group.
Our expertise can also be expanded to related pin counts sharing SOIC tooling/equipment.
Type |
Body Size |
Body Thickness |
Lead Count |
Lead Pitch |
E.P |
SOP |
3.80 mm |
1.25 mm |
7 |
1.27 mm |
|
8 |
1.27 mm |
V |
10 |
1.00 mm |
V |
14 |
1.27 mm |
V |
16 |
1.27 mm |
V |
7.62 mm |
2.35 mm |
16 |
1.27 mm |
|
18 |
1.27 mm |
|
20 |
1.27 mm |
V |
24 |
1.27 mm |
|
28 |
1.27 mm |
|
8.38 mm |
2.50 mm |
28 |
1.27 mm |
|
11.30 mm |
2.60 mm |
32 |
1.27 mm |
|
5.28 mm |
1.80 mm |
8 |
1.27 mm |
|
5.30 mm |
1.75 mm |
14 |
1.27 mm |
V |
6.00 mm |
1.50 mm |
24 |
1.00 mm |
|
Mini SOP |
3.00 mm |
0.85 mm |
8 |
0.65 mm |
V |
10 |
0.50 mm |
V |
SSOP |
3.80 mm |
1.50 mm |
16 |
0.65 mm |
|
20 |
0.65 mm |
|
24 |
0.65 mm |
V |
28 |
0.65 mm |
|
7.62 mm |
2.40 mm |
48 |
0.65 mm |
|
56 |
0.65 mm |
|
5.30 mm |
1.75 mm |
16 |
0.65 mm |
|
20 |
0.65 mm |
|
24 |
0.65 mm |
|
28 |
0.65 mm |
|
30 |
0.65 mm |
|
VSOP |
5.28 mm |
0.80 mm |
8 |
1.27 mm |
|
WSOP |
4.90 mm |
0.85 mm |
8 |
1.27 mm |
|
TSSOP |
4.4 mm |
1.00 mm |
8 |
0.65 mm |
|
1.00 mm |
14 |
0.65 mm |
V |
1.00 mm |
16 |
0.65 mm |
V |
1.00 mm |
20 |
0.65 mm |
V |
1.00 mm |
24 |
0.65 mm |
V |
1.00 mm |
28 |
0.65 mm |
V |
1.00 mm |
38 |
0.50 mm |
|
6.1 mm |
1.00 mm |
48 |
0.50 mm |
|
56 |
0.50 mm |
V |
64 |
0.50 mm |
|
TSOP |
18.4 mm |
1.00 mm |
32 |
0.50 mm |
|
48 |
0.50 mm |
|
|
|
|
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Unit: mil/mm |
|
Feature |
 Au wire diameter from 0.8mil to 2.0mil
|
Cu wire diameter available from 0.8mil to 1.2mil |
Pin Counts: from 7L up to 64L |
Min. PKG thickness: 0.8mm |
Green PKG & ROHS REACH compliance |
Pure matte tin plating |
Multi-die and stack die assembly available |
|
Packing method |
Tube / Tape & Reel available. |
|
Reliability Qualification |
Moisture Sensitivity Level |
JEDEC MSL3 (30°C / 60% RH / 192hrs) |
Temp. Cycle Test |
-65/+150°C, 500 cycles |
Pressure Cooker Test |
121°C, 100% RH, 2 atm, 168hrs |
High Temp. Storage Test |
150°C, 500hrs |
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