Product Overview
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P-DIP
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TO&SOT
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SOIC / SSOP / TSSOP
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SOJ&PLCC
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QFP / LQFP / TQFP

 

SOJ&PLCC

Overview

Small Outline J-leaded (SOJ) packages are another version of SOIC with J-type leads, instead of gull-wing leads.

Plastic Leaded Chip Carrier (PLCC) packages utilize J-lead with pin spacings of 0.05” and lead forming is wrapped around and under the edge of the package, resembling the letter J in cross section.

Greatek offers limited pin counts from SOJ and PLCC packages, developed to fulfill customer’s request, specializing in flash memory, MCU, and S-RAM products.

Type

Body Size

Body Thickness

Lead Count

Lead Pitch

SOJ

500×300

100

20

50

710×300

28

50

825×300

32

50

1025×400

110

40

50

PLCC

450×550

110

32

50

650×650

150

44

50

 

 

 

 

Unit: mil

Feature

Au wire diameter from 0.8mil to 1.3mil

Cu wire diameter available from 0.8mil to 1.2mil

Green PKG & ROHS REACH compliance

Pure matte tin plating

Multi-die and stack die assembly available.

 

Packing method

Tube packing available.

 

Reliability Qualification

Moisture Sensitivity Level

JEDEC MSL3 (30°C / 60% RH / 192hrs)

Temp. Cycle Test

-65/+150°C, 500 cycles

Pressure Cooker Test

121°C, 100% RH, 2 atm, 168hrs

High Temp. Storage Test

150°C, 500hrs

 

 

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