Overview
Small Outline J-leaded (SOJ) packages are another version of SOIC with J-type leads, instead of gull-wing leads.
Plastic Leaded Chip Carrier (PLCC) packages utilize J-lead with pin spacings of 0.05” and lead forming is wrapped around and under the edge of the package, resembling the letter J in cross section.
Greatek offers limited pin counts from SOJ and PLCC packages, developed to fulfill customer’s request, specializing in flash memory, MCU, and S-RAM products.
Type |
Body Size |
Body Thickness |
Lead Count |
Lead Pitch |
SOJ |
500×300 |
100 |
20 |
50 |
710×300 |
28 |
50 |
825×300 |
32 |
50 |
1025×400 |
110 |
40 |
50 |
PLCC |
450×550 |
110 |
32 |
50 |
650×650 |
150 |
44 |
50 |
|
|
|
|
Unit: mil |
Feature |
Au wire diameter from 0.8mil to 1.3mil
|
Cu wire diameter available from 0.8mil to 1.2mil
|
Green PKG & ROHS REACH compliance
|
Pure matte tin plating
|
Multi-die and stack die assembly available.
|
|
Packing method |
Tube packing available.
|
|
Reliability Qualification |
Moisture Sensitivity Level
|
JEDEC MSL3 (30°C / 60% RH / 192hrs) |
Temp. Cycle Test
|
-65/+150°C, 500 cycles |
Pressure Cooker Test
|
121°C, 100% RH, 2 atm, 168hrs |
High Temp. Storage Test
|
150°C, 500hrs |
|