Product Overview
..................................................

P-DIP
..................................................

TO&SOT
..................................................

SOIC / SSOP / TSSOP
..................................................

SOJ&PLCC
..................................................

QFP / LQFP / TQFP

 

P-DIP

Overview

Greatek offers P-DIP porfolio as strategic packaging solution to fulfill customers’ demand in terms of full coverage on leadframe based assembly services.

Body Size

Lead Count

Lead Pitch

Remark

300

7

100

 

8

100

 

14

100

 

16

100

 

18

100

 

20

100

 

22

100

Skinny

24

70

Shrink

24

100

Skinny

28

100

Skinny

600

42

70

Shrink

24

100

 

28

100

 

32

100

 

40

100

 

42

100

 

48

100

 

 

 

 

Unit: mil

 

Feature

Au wire diameter from 0.8mil to 2.0mil

Cu wire diameter available from 0.8mil to 1.5mil

Green PKG & ROHS REACH compliance

Pure matte tin plating

Multi-Die assembly available

No backgrind is needed.

 

Packing method

Tube packing available.

 

Reliability Qualification

Temp. Cycle Test

-65/+150°C, 500 cycles

Pressure Cooker Test

121°C, 100% RH, 2 atm, 168hrs

High Temp. Storage Test

150°C, 500hrs

 

 

 

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