Product Overview
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Wafer Bumping
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Wafer Level CSP
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BGA/LGA
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Flip Chip CSP
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QFN/DFN
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Flip Chip QFN/DFN/SOP/TSOT
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P-DIP
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TO＆SOT
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SOIC / SSOP / TSSOP
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SOJ＆PLCC
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QFP / LQFP / TQFP

 

Wafer Level CSP

Overview

Due to the market trend of semiconductor package miniaturization, WLCSP is the solution, which provides low cost, smaller scale, stable transmission and better heat dissipation benefits. GTK provides a full turnkey solution of WLCSP, including bumping, wafer probe, and DPS

Type

Die Size(mm)

Die Thickness(mm)

Bump Size(mm)

Bump Diameter(mm)

WLCSP

0.61 ~ 5.975

0.150 ~ 0.425

0.150 ~ 0.300

Max. 0.315

Feature

1. 8 inch & 12 inch

2. Thinning, backside lamination, laser marking, (laser) sawing,and tape-and-reel

3. Application: communication, PMIC, Controller, handset audio.

 

Packing method

Tape & Reel/ Waffle pack

 

 
 

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